Thick Layer Photoresist For Plating - JSR ELPAC™ THB™ series

RDL / Fine RDL
FT : 5~15 μm
Plating : Cu 

C4 / μ-Bump
FT : 20~100 μm
Plating : Cu / Ni / SnAg
High Cu pillar
FT : >100 μm
Plating : Cu

Cu Fine RDL
Product Line up
Thick Layer Photoresist For Plating
JSR ELPAC™ THB™ series 350   250   100   80   40   30   15   5
Negative Tone
High Cu Pillar
After Development

After Cu Plating After Stripping
Positive Tone
2.0 μm L/S 0.9 μm L/S Film Thickness: 5 μm Cu Plate
THB Stripped

Cu Plate
THB Stripped
Cu / Ni / SnAg Plate
THB Stripped
Film Thickness
340 μm / 100 μm φ
Cu Height 290 μm
w/ Cu Plating Chemical from Ishihara Chemical

Cyanide Au Plate
THB Stripped
Non-cyanide Au Plate
THB Stripped