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NIL materials for semiconductor lithography process.
UV curable resist for nanoimprint lithography (NIL) that contributes to cost reduction and power saving in advanced semiconductor manufacturing.
Adhesion agent for NIL that provides adhesion between substrate and resist to prevent loss of circuit patterns transferred onto the resist when the mask is peeled off at high speed.
Features ＆ Benefits
- UV curing
- Non-PFAS
- Dry etching resistance
- Excellent mask release properties
Product Lineup
- NIL resist for advanced semiconductor applications
- NIL adhesion material
- High resolution mask patterns are faithfully transferred. Complex patterns (3D structures, etc.) can be formed in one shot.
- No need for complex optics in the exposure system, simple manufacturing process (no need for developing or rinsing processes), power-saving and low-cost process.
