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/ Solstice TIMs for Telecom Data center - TGP8000PT/TGP6000PT/TGP3500PT/PTM6880

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Solstice TIMs for Telecom Data center - TGP8000PT/TGP6000PT/TGP3500PT/PTM6880

HPC, DATA CENTERS AND TELECOM EQUIPMENT

In high-performance computing (HPC) and data centers leveraging AI chips, advanced thermal management solutions such as Phase Change Material (PCM) and Thermal Gap Pads are essential for ensuring efficient operation and reliability. Phase Change Material (PCM) act by absorbing thermal fluctuations during peak AI processing loads, reducing the demand for active cooling and lowering energy costs.

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The Gap pads effectively transfer heat in densely packed server architectures, ensuring that critical components remain stable and perform optimally under high thermal loads. Both these materials provide exceptional thermal contact, adapting to variable power loads typical of AI workloads, while maintaining long-term reliability. Overall, Phase Change Materials (PCMs) and Gap Pads maximize AI chip efficiency and scalability and help mitigate risks associated with overheating, ensuring improved uptime and reduced operational costs.

Telecom/Data Center
Segment	Server	AI/HPC	Networks
Applications	GPU/CPU/Memory	GPU/CPU	Base Station/Optical Transceiver/Switch
Products	PCM - PTM7900 Thermal Gap Pad - TGP8000PT - TGP6000PT - TGP3500PT	PCMs - PTM7950 - PTM7900 - PTM6880 - PTM6000	PCMs - PTM7950 - PTM7900 - PTM7000