Adhesive - Epoxy - Sealant - Bonding in Electronics Technology

1. 

   Performance Chemicals for Semiconductor Packaging

   ECORELTM and ECOFRECTM soldering materials are utilized in processes such as ball attach (CSP, BGA), flip chip, and wafer bumping, which are used in the manufacturing of power semiconductors, flash memories, micro-modules and hybrid assemblies ECORELTM solder pastes exhibit good wettability on Ni, NiP, Cu and Pb finished surfaces with a low percentage of voids... Xem thêm

   Liên hệ
2. 

   Aluminium based copper clad laminate plate

   This series of products is the company to meet the requirements of the market, the success of the promotion and is worthy of reliance on a special plate.Has the good heat dissipation performance, the outstanding heat resistance, the good insulation reliability, the good machinability and so on characteristic.      a.... Xem thêm

   Liên hệ
3. 

   Condura®.prime and Condura®.ultra – Standard and Ag-free Silicon Nitride (Si3N4)

   Condura®.prime and Condura®.ultra – Standard and Ag-free Silicon Nitride (Si3N4) Active Metal Brazed (AMB) Substrates High thermal conductivity and mechanical robustness for demanding applications  Our Si3N4 AMB (Active Metal Brazed) substrates, including Condura®.prime and Condura®.ultra, offer high heat dissipation and increased module lifetime. These substrates stand out due to their low thermal resistance and high mechanical robustness. Specifically designed for... Xem thêm

   Liên hệ
4. 

   Heraeus Electronics SMT Adhesives PD955M

   Heraeus Electronics SMT Adhesives series: PD955M  PD955PRM  PD955PY  PD205A-Jet The Surface-Mount Technology (SMT) adhesives portfolio at Heraeus Electronics offers outstanding properties during the process as well as after soldering, ideal for high-speed processes.  During the fast placement process in Surface-Mount Technology, our adhesives with high-green strength are critical to prevent the displacement of... Xem thêm

   Liên hệ
5. 

   Fuel Cells Pastes - Heraeus

   Heraeus Thick Film Materials  for Solid Oxide Fuel Cells Pastes Materials applicable on different substrates like ceramic and steel and with different application methods are available. Based on this, Heraeus has applied its expertise to Solid. Oxide Fuel Cells (SOFC). The product range includes pastes for anodes, electrolytes, athodes, current collectors,... Xem thêm

   Liên hệ
6. 

   High Quality PCB Component Mark Ink Silksc

   Ksm-150 series UV-curable marking ink, with good screen crossing, clear character, fast curing speed, excellent adhesion, chemical resistance and insulation, suitable for single panel substrate and single, double side solder film character marking.   Model: KSM-388 Item: Technical indicators: Remark: Color: White, Black   Fineness: ≤8μm 0-25μm Scraper fineness meter Post-mixing viscosity25℃): 280±20dPa.s VT-04F Post-mixing density(25℃) 1.2-1.4g/ml   Screen: 90-120T   Film thickness: 12-16μm   Curing engery 1500-2000mJ/cm2 UV energy to reach the ink Pencil hardness： ≥4H Pencil hardness tester Adhesion: 100/100 The... Xem thêm

   Liên hệ
7. 

   FSR Series (IR) - Flexible solder resist ink solution for PCB - FPCB

   IR curable solder resist: Flexible solder resist ink for FPCB cured by infrared ray Multi color options: Black, Yellow, Green, Blue, White, Gray Key feature: Available in grossy or matte finish. Exellence flexible: Pass over 150,000 bending test Technology Advantage: Eco-friendly products (Halogen free) Capable of responding to high density integration microcircutry and multi variety  Stable of prodution capacity... Xem thêm

   Liên hệ
8. 

   Adhesives for sensor applications in vehicle interiors

   When it comes to autonomous driving, sensing technologies in the cabin also play an important role. In addition to increasing road safety, such technologies can also help monitor a vehicle's vital functions as well as detect smaller passengers. These many tasks requrie the use of a wide variety of systems... Xem thêm

   Liên hệ