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Features of SEMICOSIL® 811
• High flexibility, high-temperature
resistance and low-stress adhesive
• Fast adhesion built-up at room temperature or with moderate energy input (< 10 min at 60 – 80 °C)
• Reduced cycle times (faster processing)
• In-line QC process possible
• No UV-transparent substrates needed
• Allows automated optical inspection control, blue fluorescence under black-light
Applications
• Automotive electronics
• Sensor applications
• Various kinds of electronics control units
• Bonding display glass
• Covers to frame
Features of SEMICOSIL® 871/1K TC
• 1.3 W/mK thermal conductivity
• Long pot life
• Bonding different materials to one another
• No contact corrosion
• High temperature stability
• Storage stability
Application
• Electronics
• Semiconductor
• Automotive
• Elements of the heat generation in a variety of industries
