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These customized, application specific offerings provide improved cost of ownership (CoO), increased yield and ease-ofuse. Our application expertise maximizes customer wafer thinning processes with application development support and troubleshooting know-how while our consistent drum-to-drum and bottle-to-bottle wafer etching characteristics provide unsurpassed batch-to-batch product uniformity. A robust manufacturing infrastructure and application expertise further enable Honeywell to deliver flexible end products, custom-matched tothe best chemistry formulations for customer processes and specifications
Physical Properties
- Boiling Point/Range
- 100 °C
- Color
- Colorless to Yellowish
- Density
- 1.13 g/cm3 (20 °C)
- Flashpoint
- Not applicable
- Melting Point/Range
- No data available
- Odor
- Stinging
- pH
- Acidic
- Physical form
- Liquid
- Solubility in Water
- Completely miscible
