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Improving Your Productivity with Our Proprietary Performance Coatings

To address the high cost of advanced nodes, chipmakers are seeking new ways to increase yield and tool availability. Chamber management, particularly particle performance, is critical to optimizing the manufacturing process. Longer preventative maintenance (PM) cycles can be achieved by reducing part corrosion for etch processes and increasing adhesion for deposition processes such as PVD. Coating applications to a part can extend the Mean Time Between Cleans (MTBC). Advanced coatings are increasingly being implemented to deliver lower cost-of-ownership (COO) while delivering excellent process performance.

Increase Reactor Uptime & Reduce Defects With Our Advanced Coatings

As the worldwide leader in ultra-high purity semiconductor chamber tool parts cleaning, coating, and analytical verification, UCT Services Division and UCT ChemTrace provide you solutions that improve your process performance and lower your overall cost-of-ownership

UCT Services Division is the only semiconductor parts cleaning and coating company with an accredited in-house analytical laboratory business – UCT ChemTrace – the only company that can deliver ultra-high purity semiconductor process chamber tool parts for your business verified by a Certificate of Analysis.

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To maintain a clean process environment, PVD chambers require adhesion of excess sputtered material to exposed part surfaces. Greater adherence means thicker films can accumulate on the part surface, thereby reducing the frequency of PM. Since residual stress depends on the material (e.g., Ti, TiN, W), optimization of the coating is critical. Arc spray technology enables the application of aluminum and other metal/alloy coatings to the part substrate, delivering a barrier layer with the required surface roughness for the deposited material to adhere. To reduce the recycle loop turnaround time, our Environmentally Clean Process (ECP) removes the deposition and existing coating in an environmentally safe manner while closely maintaining the part dimension. ECP cleaning extends part lifetime, lowering overall COO.

Halogen-containing plasmas in etch not only pattern the wafer; but, they also react with chamber parts. To address this, our advanced coatings provide more uniform and higher quality coatings to increase part lifetime and reduce particles. Chambers utilizing coated parts have higher uptime and wafer output. Traditionally, the industry used yttria (Y2O3) to protect plasma-exposed part surfaces; however, newer coatings improve barrier performance and reduce post-PM chamber seasoning and qualification time. Our advanced coating technology uses proprietary applications and the most advanced thermal spray technology.

Protective coatings for etch applications using plasma spray suite of coatings offer:

Strong surface adhesion
Low porosity
Smooth, hard surfaces
Improved resistance to etch products
Superior dielectric properties

We are constantly developing new coating, removal and clean processes in our laboratories and now offer these coatings in most of our major semiconductor locations including a line of C-coats for PVD and M-coat for etch.

Sacrificial coating for PVD applications using TWAS suite of coatings offer:

Strong surface adhesion
Low porosity with a rougher surface means improved deposition adhesion
Clean surfaces that are low in metallic and organic impurities as well as particles