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ECORELTM and ECOFRECTM soldering materials are utilized in processes such as ball attach (CSP, BGA), flip chip, and wafer bumping, which are used in the manufacturing of power semiconductors, flash memories, micro-modules and hybrid assemblies
ECORELTM solder pastes exhibit good wettability on Ni, NiP, Cu and Pb finished surfaces with a low percentage of voids and excellent flux residue. cleanability.
PROMOCLEAN™ Disper 607 water-based solution
• High wetting performance permits efficient removal of lead-free solder pastes and fluxes
• High rinsing capacity to reduce cycle times
• Environmentally-friendly
• Ideal using spray-in-air or by dipping with automated processes, including ultrasonics or jetting systems
For hybrid packaging, our cleaning solutions can integrate water and solvent based chemistries to efficiently removed organic and inorganic residues that remain on the substrate.
INVENTEC has decades of experience in chemicals used for cleaning the core of power electronics systemsto the most stringent reliability, performance, cost, and environmental requirements.
Our product offering also includes specialized cleaning solutions uses during each cleaning step required during the assembly of IGBT power modules.
