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Two component hybrid thermal gels can be cured in a short time after two-component mixing at room temperature. HLT series thermal gels require curing but very little pressure during installation (5-10psi or the weight of a heatsink is sufficient). You can speed up the process by curing at elevated temperatures (80 -100°C). The high compressibility minimizes thermal resistance at interfaces, making hybrids ideal for low stress applications while maintaining excellent performance during reliability testing.
HLT10000 High TC Hybrid Thermal Interface Material (TIM) has a thermal conductivity of 10 W/mK, high reliability, and ease of dispensing. It can be cured after two-component mixing and faster under higher temperatures. Its high compressibility minimizes interface thermal resistance while maintaining excellent performance during reliability testing.
This product is engineered for the most demanding and delicate applications on the market. It starts with a very low thickness and compresses just as easily, reaching its final thickness at a remarkable rate. It is also easy to dispense and rework, making it ideal for high volume manufacturing. To add to that, it offers reduced oil separation and doesn't exhibit pump out or cracking.
HGP14 is a high-performance thermal interface material designed for efficient heat transfer in demanding electronic applications. It offers a thermal conductivity of 14.0 W/m·K, making it well-suited for systems requiring high thermal dissipation across varying bond line thicknesses.
The material is soft and conformable, allowing it to fill gaps between components and heat sinks without introducing significant mechanical stress. This makes it suitable for use with fragile components or assemblies where minimizing stress during installation is critical.
HGP14 also maintains material integrity over time, with low volatility and minimal oil bleed, reducing the risk of contamination or pump-out under thermal cycling. Its stability makes it a strong choice for applications sensitive to oil migration or where long-term performance is required.
Solstice HGP14 is well-suited for high-power electronics, automotive systems, and telecommunications equipment, where superior heat dissipation and long-term stability are essential.
