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- / Thermal Grease - TG5500/TG4000/TG2800I/TG3000I/TG2500
Thermal Grease is a common silicone thermal interface material, usually used to increase thermal contact conductance across jointed solid surfaces. Thermal interface materials occupy the space of air (a very poor thermal conductor) and fill in the gaps between two solid surfaces. This establishes an effective thermal path between a heat-generating component and a heat sink attached to it, therefore greatly increasing thermal transfer efficiency.
Silicone thermal grease is a composite containing silicone and inorganic or metal nanomaterials with high thermal conductivity. It has been a great replacement for pyrolithic graphene sheets. Compared with thermal pads or liquid gap fillers, grease has the lower viscosity, and it can be used by dispense or screenprint, forming a thinner thermal conductivity layer with high thermal conductivity performance.
Benefits and feature:
• Low viscosity and excellent thixotropy for dispensing, stencil printing, or screen printing.
• Broad BLT range for different application.
• Different thermal resistance and thermal conductivity for different power density
• High stability and reliability
• Stable homogeneous mixture under room temperature storage
TG5500 and series TG4000/TG2800I/TG3000I/TG2500 Thermal Silicone Grease offers the highest thermal conductivity of our product line (5.5 W/mK) and a controlled bond line thickness of 23 micron @35psi, 50oC. Its viscosity and excellent thixotropy make it fit for large–scale production with dispensing, screen printing and stencil printing. It is an excellent, option for thermally demanding applications that can support a >20um BLT.
TG5500 is used for applications with high power density requirements. It provides superior thermal performance with ease of use across a multitude of applications. It is a stable homogeneous mixture under room temperature with an operating temperature range of -40oC to 150oC. Please note that this thermal grease contains solvent and requires a drying step.
