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The NanoProof® 3 series provides up to IPX5 level protection to PCBs and electronic components. This liquid-phase coating series utilizes proprietary polymer technology to achieve dust and water protection across many substrates on a PCB. The NanoProof® 3 series features flexible application methods including spray, dip, and dispensing, with no cure requirement as well as quick processing times, improved yields and reduced equipment costs.
The NanoProof® 3 Series Extender is a fluorinated solvent used for cleaning, diluting, and as a carrier solvent for several of Aculon’s branded products. It is a direct alternative to 3M NOVEC 7100.
The NanoProof® 3 has excellent compatibility with multiple materials such as ABS, EPDM, Fluoroelastomers, Polypropylene, PTFE and other. You can find more in the additional information section.
| Material | Compatibility |
| ABS |
At boiling point for 3 days, <0.1% Weight change, <0.1% Linear swell |
| EPDM |
At boiling point for 3 days, <0.1% Weight change, <0.1% Linear swell |
| Fluorelastomer |
At boiling point for 3 days, >86% Weight change, >24% Linear swell |
| Polymethyl methacrylate | At boiling point for 3 days, affected, affected |
| Polypropylene |
At boiling point for 3 days, <2.5% Weight change, <1% Linear swell |
| Polysterene |
At boiling point for 3 days, <0.1% Weight change, <0.1% Linear swell |
| PTFE |
At boiling point for 3 days, <2.5% Weight change, <0.1% Linear swell |
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