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WACKER SilGel® 612/613/616/619 - POWERSIL® Gel C670

WACKER expands its thermal conductive material portfolio by a new gap filler for electronics and electrical applications as well as for battery applications. The constantly increasingdemand for heat dissipation between two substrates with high tolerances calls for a gap filler, which is easy and cost effectively to handle and renders save functionality and durability.

Power semiconductors are being manufactured in ever higher quantities. Toreduce cycle times, encapsulants that cure rapidly are in demand. Our modular system offers you unique flexibility. Depending on the catalyst of choice, you can specify the curing time yourself. For example, a gel time of about 3 hours is achieved with a platinum catalyst at 20 °C

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Protection against vibrations and corrosion: the amount of electronic components in cars is constantly increasing. Encapsulation makes control systems resistant to everything that impacts on vehicles: vibrations, temperature fluctuations and moisture. Image: encapsulation of an automotive electronic controller with WACKER SilGel® 612

Typical silicone gels cure to form soft products. However, some applications require enhanced mechanical protection. For this, we offer you so-called tough silicone gels with increased
hardness. Soft silicone gels typically have a modulus of elasticity of 5 to 10 kPa. This is too
low for applications such as the potting of solar junction boxes. For this purpose, we have developed silicone gels with increased hardness (see table). The measurement parameter is no longer material penetration, but Shore 00 hardness.