Introducing innovative solder resist ink solution for PCB - FPCB. Opening the future of electronics with advanced materials that combine flexibility and durability.
Electronic devices such as smartphones and tablet PC are rapidly becoming smaller, thinner, and more multifunctional
In order to realize the thin, light, and portable characteristics of mobile devices, slimming of FPCB is required. Opening the future of electronics with advanced materials that combine flexibility and durability. There is a need to develop flexible inks to replace PI coverlays
Common epoxy acrylate based solder resists
Characteristics susceptible to bending or warping
High flexibility achieved by introducing special flexibility
Excellent characteristics realized through optimal combination of photosensitive and reactive groups
Capable of responding to high-density integration, microcircuitry and multi-variety
Capable of responding to high-density integration, microcircuitry and multi-variety
IR-curable products have similar performance to UV-curable products, but differ slightly in viscosity and curing time.
