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DELO offers an extensive range of products for smart card modules that covers all requirements necessary for the bonding and long-term protection of chips. It includes various die attach adhesives and encapsulants that can be used as dam & fill or glob top. The DELO portfolio also includes special conductive adhesives for flip-chip process-based production. In line with the relevant requirement profile, products satisfy all demands from tension equalization to hardness and very high strengths.
