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Bonding of RFID chips

Properties / strengths of DELO products

  • Anisotropic conductive and non-conductive adhesives available
  • Very good adhesion to various substrates
  • Humidity-resistant
  • Very fast curing (< 1 second), easy to process
  • Designed for common processes
    such as heat pulse, thermode curing, and flip-chip

From product packaging and ski passes to RFID transponders: Reliable radio tag function hinges on the connection between the semiconductor chip and the antenna. Semiconductor adhesives play an important functional role. They fix the tiny chips onto the antenna and in most cases also contact them electrically.

DELO is the world's leading manufacturer of RFID adhesive solutions. Around four out of five RFID labels contain a drop of DELO adhesive. Depending on the process, anisotropic conductive (ACA) or non-conductive (NCA) adhesives are used to bond the chips. Specially developed for LF, HF and UHF antennas, DELO's epoxy resins satisfy the high requirements demanded of strength, temperature and humidity resistance, and ensure fast processes. Adhesive and machine integrators aim for an output of 100,000 RFID labels per hour.

In addition to reliable adhesives for RFID labels, DELO offers comprehensive support to ensure that the system comprising adhesive, chip, substrate and equipment is optimally and reproducibly matched. DELO works closely with many machine integrators to ensure this.

 

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