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Flexible electronics offer enormous advantages over conventional electronics on classic PCBs in terms of design freedom and the associated weight and cost reductions. Particularly in the case of flexible hybrid electronics (FHE), whose high functionality is largely determined by the integration of rigid SMD components, adhesives can have many applications.
Complex circuits are applied to flexible and particularly elastic carrier foils by printing with conductive silver inks. These substrates are usually very temperature-sensitive and, therefore, difficult to access for soldering processes. In addition, subsequent use creates high mechanical demands for the substrate/SMD component interface.
DELO offers competent solutions for electrical bonding as well as structural bonding of electrical components (SMD) on flexible substrates.
Depending on the component size and process, electrical connections can be made with isotropic conductive adhesives (ICA) or anisotropic conductive adhesives (ACA). Structural reinforcement via non-conductive adhesives (NCA) is an established technique, especially when combined with ICAs, to ensure reliable long-term functionality.
When combined, DELO DUALBOND® IC343 and DELO DUALBOND® AD345 are already successfully used in a large number of applications with flexible electronics
