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Argomax 2141® Paste is an integrated solution and an extension to the highly successful Argomax range. This product is a dispensable paste offering flexibility and ease of use. The paste has specifically been developed for large packages (or components) on gold- and silver-finished substrates (like DBC, Aluminum and Copper coolers). Argomax 2141® paste offers exceptional performance and is aligned with the Argomax range.
Argomax 2140® Paste provides excellent thermal conductivity due to its high silver content, aiding in efficient heat dissipation.
Ensures low electrical resistivity, creating a highly conductive bond essential for high-power applications, enhancing device performance and reliability.
The sintered silver bond line offers robust adhesion, making it suitable for devices that undergo high thermal and mechanical stress.
Used in power inverters, modules, and other components where efficient heat dissipation and electrical conductivity are essential. The paste's high thermal conductivity helps maintain operational stability and prolongs device lifespan
The paste is commonly used in power inverters and modules, where high thermal conductivity and electrical performance are critical. Its robust bonding capabilities help improve the efficiency and longevity of power electronic systems..
Ideal for Electric Vehicle (EV) powertrains and battery management systems, where reliable thermal management and strong electrical connectivity are vital.
Commonly used in die-attach applications for semiconductors, where high bond strength and electrical conductivity are crucial.
The paste’s excellent thermal and electrical properties make it suitable for high-power modules and photonic devices.
