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ALPHA® HiTech® UP44-5566T

A UV-curing system, suitable for rapid curing and bonding in diverse applications, including coating and component fixing.

Ensures the secure attachment of lenses within camera modules, offering fast curing and strong adhesion for precise alignment.

Provides reliable bonding for image sensors, maintaining stability and alignment to ensure optimal image quality and durability.

Ideal for bonding IR filters, contributing to improved camera functionality by providing a fast-curing, stable adhesive layer that withstands environmental stressors.

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A versatile, high-performance underfill adhesive specifically developed for electronics assembly applications. This single-component adhesive provides excellent reliability and protection for delicate components, particularly in Surface-Mount Technology (SMT) and flip-chip assemblies. ALPHA® HiTech UP44-5566T offers a fast curing process, ensuring high throughput in production.

This adhesive cures quickly under ultraviolet light, enabling faster processing times and making it ideal for high-volume manufacturing.

ALPHA® HiTech® UP44-5566T provides strong adhesion to various substrates, enhancing the stability and longevity of bonded components

The adhesive is halogen-free and Restriction of Hazardous Substances (RoHS) compliant, ensuring environmental safety and compliance with global regulatory standards.The adhesive is halogen-free and Restriction of Hazardous Substances (RoHS) compliant, ensuring environmental safety and compliance with global regulatory standards.

Facilitates the secure attachment of FPC components, essential for flexibility and performance in compact camera modules.