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Adhesives are key components in semiconductor-based devices. DELO semiconductor adhesives are used to bond, contact and encapsulate chips and other SMD components on printed circuit boards. From RFID labels, MEMS sensors to optical components – DELO semiconductor adhesives are used wherever short cycle times and maximum precision are demanded. DELO has also developed special products for the advanced packaging industry. These help increase package performance.
DELO develops tailored functional materials optimized for different applications such as die attach, underfilling, cap bonding and encapsulation. The materials are used to bond individual components, protect components, reinforce solder joints (e.g. as Edge Bond or Corner Fill) and to produce precise 3D structures. They are used in MEMS sensors, for example. DELO materials therefore enable new and more efficient production processes (through temporary bonding, debonding, reworkability, etc.) and are optimally suited for fully automated series production. They can be applied by screen printing, stencil printing and jetting
