Sản phẩm đã cho vào giỏ hàng
LEDs are widely used due to their small form factor and high efficiency – as ambient lights or for sensors, for instance. They enable increasing miniaturization as well as design flexibility and versatile applications.
Functional adhesives play a key role in the production of LED packages. They ensure brilliant, homogeneous diode illumination and fast production. DELO has developed a host of suitable products for both first- and second-level packaging. In first-level packaging, the adhesives are applied in the immediate vicinity of the LED semiconductor. In second-level packaging, the adhesives are used to join lenses, cover disks and housings that are used around the LED module.
DELO's adhesive portfolio for optoelectronics includes transparent and low-outgassing, tension-equalizing and electrically conductive adhesives, and die attach to structural bonding. Optical coatings with customized properties regarding transmission, reflection and absorption, as well as encapsulants to protect sensor packages, are also offered by DELO. Users can select products with different curing mechanisms depending on the component geometry or substrate combination.
