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Bonding sensors in smartphones and similar devices. For lens bonding and active alignment processes, for example, DELO has developed special dual-curing products and mCD- &VLT-based adhesives. They can be fixed under light in less than a second, cured at very low temperatures ≥ 60 °C and offer properties such as low outgassing, high temperature stability and humidity resistance. And when it comes to the simultaneous structural bonding and electrical contacting (grounding) of metal components, special isotropic, electrically conductive adhesives from the DELO DUALBOND and DELO MONOPOX series are suitable for this task. They are optimized for low-temperature curing and dispense with soldering processes that can damage temperature-sensitive components.
