ALPHA® HiTech® AD13-9692B

A one-component, low-temperature curing epoxy adhesive designed specifically for bonding heat-sensitive devices. Ideal for applications in camera modules and other optical devices where low thermal exposure is critical, the AD13-9692B offers strong adhesion at temperatures low enough to prevent damage to sensitive components, while maintaining flexibility in automated manufacturing.

Allows for effective bonding at temperatures as low as 80°C, reducing the risks of heat damage to sensitive components.

Simplifies the manufacturing process by eliminating the need for mixing, helping to maintain consistent quality.

Compatible with substrates like stainless steel, polyimide, and Liquid Crystal Polymer (LCP), broadening its range of applications.

Ensures stable adhesion for optical devices that require precise and reliable assembly under low-temperature conditions.