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* These values provide general information and are not part of the product specification.
Regarding thickness and width, certain restrictions may apply. MD/CD values may vary depending on thickness and
width. Our „General Conditions of Sale“ also apply.
1) Calculated based on information by raw material suppliers and the film ’s composition.
2) Based on data by raw material supplier, not measured on film sample.
Special characteristics:
- Non-blocking / non-tacky at room temperature
- Low temperature activation and easy processing as film substrate
- Strong and irreversible bonding on a range of materials like PVC, ABS, PA, PC, wood, lacquers, textiles and metals
- High durability after heat activation, high peel and shear strenght
- Solvent free adhesive film, forms cross-linked bonds between molecules
- Constant and smooth film thickness
Recommended processing:
- Processing temperature (bond line temperature): >90°C
- Pressure: >1 bar
- The processing parameters have to be adapted to the individual substrates and the used equipment. Processing time depends on the substrates thickness and their thermal capacity and conductivity.
Remark:
The recommended bonding conditions vary depending on the machinery, fabric, substrate and application. Before production, the optimal bonding conditions should be determined for each application.
At temperatures >35°C the cross linking reaction may start already. From 45°C the polymer melts and the film will be sticky.
The cross linking of the polymer improves the bond strength, the heat resistance of the bond as well as the chemical and
hydrolysis resistance of the bond line. The crosslinking reaction is typically finished within 24 hours after the bonding process.
Storage
- Storage in original and sealed Covestro packaging
- Preferred storage temperature 15°C - 25°C
- Maximum storage / shipping temperature 35°C
- Do not store the film in the vicinity of heaters, radiators or any other heat source
- Direct sunlight should be avoided
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Typical Values
Property Value Unit of measurement Method Density approx.1,1 g/cm³ 1) Weight per unit area 55 or 85 g/m² Melting temperature of the PU polymer approx. 45 2) °C DSC Glass transition temperature of the PU polymer approx. -50 2) °C DSC Curing temperature from about 35 °C determined empirically Softening range of the cross linked film 180 - 200 °C TMA - internal method
