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Heraeus Electronics SMT Adhesives series: PD955M PD955PRM PD955PY PD205A-Jet The Surface-Mount Technology (SMT) adhesives portfolio at Heraeus Electronics offers outstanding properties during the process as well as after soldering, ideal for high-speed processes.
During the fast placement process in Surface-Mount Technology, our adhesives with high-green strength are critical to prevent the displacement of components until they are fully soldered.
Heraeus Electronics SMT adhesives, which are one-component, thermo-setting, solvent-free adhesives, provide excellent adhesion across a variety of components, even those considered difficult to glue. Our adhesives are designed for maximum throughput and low cost of ownership, adaptable to all common application methods including printing, dispensing, pin transfer, and jetting.
Cleaning Instructions
Before curing: The adhesive can be removed with Zestron HC and other Zestron and Vigon cleaning materials. Do not use alcohol as this will cure the adhesive. Cleaned dispensing units should be completely dried before installation. After Curing: Defective components can be replaced by heating (with hot air) the cured adhesive joint above 100°C. After removing the component (torsion movement), the hot air should be focused on the remaining adhesive in order to remove it with a sharp tool.
