Sản phẩm đã cho vào giỏ hàng
| FEATURES: |
| – Adjustable spring-loaded roller assembly ensures bubble-free lamination |
| – Adjustable cutting angle, depth, and diameter to control the amount of film overhang |
| – Adjustable roller pressure from topside to accommodate different film requirements and various wafer thicknesses |
| – Cuts film to edge of wafer, including flats, within 0.005″ |
| – Vacuum-securing wafer stage |
| – Wafer-centering mechanism |
| – Retractable cutting knife blade for operator safety |
| – Adjustable alignment pins accommodate any wafer size |
| – Adjustable cutter assembly for either a “contact cut” (wafers with alignment flat(s)) OR a “non-contact cut” (wafers with an alignment notch) |
| – Spring-loaded tensioner bar prevents wafer stress due to film stretch |
| – Operates with backed or non-backed film. Optional Take-up Roller Assembly available for film with backed liner. |
| OPTIONS: |
| – Protective Film Take-up Roller Assembly: A gear-driven take-up Roller Assembly is available for use with protective layer-backed films, which automatically winds the protective layer onto a plastic core for easy handling and disposal. |
| – Static Eliminator (with or without Power Safety Interlock Switch): A static ionization bar prevents static build-up caused from either the film unwinding or from the separation of the film from the protective layer. |
| – ‘CE’ Mark |
| [Model UH108-8]: |
| – 5″ Wafer Capability |
| – 6″ Wafer Capability |
| [Model UH108-12]: |
| – 8″ & 12″ Wafer Capability |
