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Evaporation of different materials, including metals (metal lift-off) and oxides, different wafer sizes (from 1 to 6 inch, 8 and 12 inch on request) and capacity to manage high material volumes. Our solution is fully customizable and flexible.
Experience cutting-edge evaporation technology with our uniquely designed system featuring a source-to-dome distance of 1.3 meters, allowing for long throw evaporation. Our adaptable dome precisely caters up to 6x 150 mm diameter substrates with an option for 200 mm capacity upon request, ensuring versatility and superior coverage for your high-precision manufacturing needs.
Uniting an electron-beam gun with a plasma source, our advanced process innovation for Plasma-Impulse Atomic Deposition (PIAD) improves thin-film quality and adhesion. This combination results in precise thickness control and expanded material capabilities.
Our designed deposition system introduces a state-of-the-art dome constructed to achieve nearly perpendicular deposition angles, ensuring directional coatings of the highest precision. This innovative approach provides unparalleled uniformity and quality in thin-film applications, setting a new standard for accuracy and performance in the industry.
