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Ultron Systems’ Model UH110 and UH110-8 is wafer backgrinding protective - film remover - Semiautomatic Film Removers demount film from 3″ to 8″ wafers after the backgrinding or etching process. The virtual 180° peeling angle ensures more efficient peeling and lower stress on the wafer, resulting in higher yields. Both systems outperform time-consuming hand removal at a fraction of the cost of fully automatic equipment. Throughput is as high as 200 wafers/hour. The standard Model UH110 can accommodate up to 6″ wafers, while the Model UH110-8 handles 8″ wafers and smaller. Adjustments from one size wafer to another can be made in seconds by simply changing the workstage. Push-button operation assures ease of use with all operator variables eliminated.
| FEATURES: |
| – Short removal cycle for higher throughput |
| – Virtual 180° peeling angle for lower wafer stress and higher yields |
| – Heated wafer stage: ensures film removal with minimal stress to wafer |
| – Quick peeling-tape reloading |
| – Easy disposal of demounted protective film |
| – No special operator training required |
| – Compact, tabletop size |
| – Faster and lower cost than conventional chemical removal method |
| – Interchangeable wafer stage accommodates different size/type of wafers |
| – Removes film from wafers down to 8 mil thick wafer [UH110-8] |
