Adhesive - Epoxy - Sealant - Bonding in Electronics Technology

1. 

   ALPHA® Argomax® 2040 - 2041 Paste

   Argomax 2141® Paste is an integrated solution and an extension to the highly successful Argomax range. This product is a dispensable paste offering flexibility and ease of use. The paste has specifically been developed for large packages (or components) on gold- and silver-finished substrates (like DBC, Aluminum and Copper coolers).... Xem thêm

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2. 

   ALPHA® Argomax® 2020 Paste

   A silver sinter paste, providing high thermal and electrical conductivity. The paste provides superior thermal conductivity and low electrical resistivity, ensuring efficient heat and current transfer within devices The paste provides superior thermal conductivity and low electrical resistivity, ensuring efficient heat and current transfer within devices. Creates strong silver sinter bonds that enhance... Xem thêm

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3. 

   ALPHA® HiTech® UP44-5566T

   A versatile, high-performance underfill adhesive specifically developed for electronics assembly applications. This single-component adhesive provides excellent reliability and protection for delicate components, particularly in Surface-Mount Technology (SMT) and flip-chip assemblies. ALPHA® HiTech UP44-5566T offers a fast curing process, ensuring high throughput in production. This adhesive cures quickly under ultraviolet light, enabling... Xem thêm

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4. 

   ALPHA® HiTech® AD13-9692B

   A one-component, low-temperature curing epoxy adhesive designed specifically for bonding heat-sensitive devices. Ideal for applications in camera modules and other optical devices where low thermal exposure is critical, the AD13-9692B offers strong adhesion at temperatures low enough to prevent damage to sensitive components, while maintaining flexibility in automated manufacturing. Allows for... Xem thêm

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5. 

   ALPHA® HiTech® AD13-9521B

   A high-performance, one-component epoxy adhesive designed for bonding applications in electronics manufacturing. It provides excellent adhesion to a variety of substrates, including metals, ceramics, and plastics, making it versatile for diverse assembly needs. It cures quickly at low temperatures, making it ideal for heat-sensitive components, ensuring reliability while minimizing thermal... Xem thêm

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6. 

   CK Plasma coating

   CK PLASMA 3 coating is our latest development that has been designed to allow you to meet the printing requirements of the future with process reliability guaranteed, with a particular focus on ultra fine line & pitch applications. Poor soldering points or frequent cleaning can disturb the printing process and... Xem thêm

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7. 

   Cp2Mg SSG Bis(cyclopentadienyl)magnesium

   Cp2Mg SSG is a magnesium precursor (Select Semiconductor Grade) for the deposition of compound semiconductors and commonly applied as dopant in GaN-based material systems.  Nouryon uses leading edge processes, purification and transfilling techniques that ensure the repeatable and consistent delivery of our Cp2Mg SSG in each cylinder that we supply. We... Xem thêm

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8. 

   Performance Chemicals for Semiconductor Packaging

   ECORELTM and ECOFRECTM soldering materials are utilized in processes such as ball attach (CSP, BGA), flip chip, and wafer bumping, which are used in the manufacturing of power semiconductors, flash memories, micro-modules and hybrid assemblies ECORELTM solder pastes exhibit good wettability on Ni, NiP, Cu and Pb finished surfaces with a low percentage of voids... Xem thêm

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