Adhesive - Epoxy - Sealant - Bonding in Electronics Technology

1. 

   Bayfol® LR 5902

   * These values provide general information and are not part of the product specification. Regarding thickness and width, certain restrictions may apply. MD/CD values may vary depending on thickness and width. Our „General Conditions of Sale“ also apply. 1) Calculated based on information by raw material suppliers and the film ’s composition. 2) Based on data... Xem thêm

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2. 

   Makrolon® FR6019 CTI

   Property Test Condition Value Unit Standard Melt Volume-flow Rate (MVR) 300 °C/ 1.2 kg 13 cm³/10 min ISO 1133-1 Molding Shrinkage, parallel 60x60x2 mm/ 500 bar 0.50 - 0.60 % ISO 294-4 Molding Shrinkage, normal 60x60x2 mm/ 500 bar 0.50 - 0.60 % ISO 294-4 Melt Viscosity 1000 s^-1^/ 300 °C 200 Pa·s b.o. ISO 11443-A   Property Test Condition Value Unit Standard Tensile Modulus 1 mm/min 2,470 MPa ISO 527-1,-2 Yield Stress 5 mm/min 66 MPa ISO 527-1,-2 Yield Strain 5 mm/min 6 % ISO 527-1,-2 Nominal Strain at Break 5 mm/min > 50 % ISO 527-1,-2 Strain at Break 5... Xem thêm

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3. 

   Plasticizers - PHTHALATES FREE

   PHTHALATE-FREE Product name                                                     CAS No Bis(2-ethylhexyl)adipate / DOA                        123-79-5 Acetyl-tri-ethylcitrate / ATEC           ... Xem thêm

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4. 

   UV Absorbers - Distosorb UV 157

   Our portfolio includes the following REACH registered products: Description                CAS                                         Applications UV-1164                 2725-22-6             ... Xem thêm

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5. 

   ALPHA® Argomax® 2040 - 2041 Paste

   Argomax 2141® Paste is an integrated solution and an extension to the highly successful Argomax range. This product is a dispensable paste offering flexibility and ease of use. The paste has specifically been developed for large packages (or components) on gold- and silver-finished substrates (like DBC, Aluminum and Copper coolers).... Xem thêm

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6. 

   ALPHA® Argomax® 2020 Paste

   A silver sinter paste, providing high thermal and electrical conductivity. The paste provides superior thermal conductivity and low electrical resistivity, ensuring efficient heat and current transfer within devices The paste provides superior thermal conductivity and low electrical resistivity, ensuring efficient heat and current transfer within devices. Creates strong silver sinter bonds that enhance... Xem thêm

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7. 

   ALPHA® HiTech® UP44-5566T

   A versatile, high-performance underfill adhesive specifically developed for electronics assembly applications. This single-component adhesive provides excellent reliability and protection for delicate components, particularly in Surface-Mount Technology (SMT) and flip-chip assemblies. ALPHA® HiTech UP44-5566T offers a fast curing process, ensuring high throughput in production. This adhesive cures quickly under ultraviolet light, enabling... Xem thêm

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8. 

   ALPHA® HiTech® AD13-9692B

   A one-component, low-temperature curing epoxy adhesive designed specifically for bonding heat-sensitive devices. Ideal for applications in camera modules and other optical devices where low thermal exposure is critical, the AD13-9692B offers strong adhesion at temperatures low enough to prevent damage to sensitive components, while maintaining flexibility in automated manufacturing. Allows for... Xem thêm

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