Adhesive - Epoxy - Sealant - Bonding in Electronics Technology

1. 

   ALPHA® HiTech® AD13-9521B

   A high-performance, one-component epoxy adhesive designed for bonding applications in electronics manufacturing. It provides excellent adhesion to a variety of substrates, including metals, ceramics, and plastics, making it versatile for diverse assembly needs. It cures quickly at low temperatures, making it ideal for heat-sensitive components, ensuring reliability while minimizing thermal... Xem thêm

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2. 

   CK Plasma coating

   CK PLASMA 3 coating is our latest development that has been designed to allow you to meet the printing requirements of the future with process reliability guaranteed, with a particular focus on ultra fine line & pitch applications. Poor soldering points or frequent cleaning can disturb the printing process and... Xem thêm

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3. 

   Cp2Mg SSG Bis(cyclopentadienyl)magnesium

   Cp2Mg SSG is a magnesium precursor (Select Semiconductor Grade) for the deposition of compound semiconductors and commonly applied as dopant in GaN-based material systems.  Nouryon uses leading edge processes, purification and transfilling techniques that ensure the repeatable and consistent delivery of our Cp2Mg SSG in each cylinder that we supply. We... Xem thêm

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4. 

   Performance Chemicals for Semiconductor Packaging

   ECORELTM and ECOFRECTM soldering materials are utilized in processes such as ball attach (CSP, BGA), flip chip, and wafer bumping, which are used in the manufacturing of power semiconductors, flash memories, micro-modules and hybrid assemblies ECORELTM solder pastes exhibit good wettability on Ni, NiP, Cu and Pb finished surfaces with a low percentage of voids... Xem thêm

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5. 

   Aluminium based copper clad laminate plate

   This series of products is the company to meet the requirements of the market, the success of the promotion and is worthy of reliance on a special plate.Has the good heat dissipation performance, the outstanding heat resistance, the good insulation reliability, the good machinability and so on characteristic.      a.... Xem thêm

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6. 

   Condura®.prime and Condura®.ultra – Standard and Ag-free Silicon Nitride (Si3N4)

   Condura®.prime and Condura®.ultra – Standard and Ag-free Silicon Nitride (Si3N4) Active Metal Brazed (AMB) Substrates High thermal conductivity and mechanical robustness for demanding applications  Our Si3N4 AMB (Active Metal Brazed) substrates, including Condura®.prime and Condura®.ultra, offer high heat dissipation and increased module lifetime. These substrates stand out due to their low thermal resistance and high mechanical robustness. Specifically designed for... Xem thêm

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7. 

   Heraeus Electronics SMT Adhesives PD955M

   Heraeus Electronics SMT Adhesives series: PD955M  PD955PRM  PD955PY  PD205A-Jet The Surface-Mount Technology (SMT) adhesives portfolio at Heraeus Electronics offers outstanding properties during the process as well as after soldering, ideal for high-speed processes.  During the fast placement process in Surface-Mount Technology, our adhesives with high-green strength are critical to prevent the displacement of... Xem thêm

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8. 

   Fuel Cells Pastes - Heraeus

   Heraeus Thick Film Materials  for Solid Oxide Fuel Cells Pastes Materials applicable on different substrates like ceramic and steel and with different application methods are available. Based on this, Heraeus has applied its expertise to Solid. Oxide Fuel Cells (SOFC). The product range includes pastes for anodes, electrolytes, athodes, current collectors,... Xem thêm

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