Adhesive - Epoxy - Sealant - Bonding in Electronics Technology

1. 

   DELO DUALBOND and DELO MONOPOX

   Bonding sensors in smartphones and similar devices. For lens bonding and active alignment processes, for example, DELO has developed special dual-curing products and mCD- &VLT-based adhesives. They can be fixed under light in less than a second, cured at very low temperatures ≥ 60 °C and offer properties such as low outgassing, high temperature... Xem thêm

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2. 

   DELO PHOTOBOND

   DELO PHOTOBOND adhesives are suitable for bonding a wide range of plastic components. Due to the fact that they cure within seconds, they allow particularly fast processes. The fluorescence of the adhesives enables reliable application control in automated processes. DELO DUALBOND adhesives combine the advantages of light curing with a second curing mechanism... Xem thêm

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