Adhesive - Epoxy - Sealant - Bonding in Electronics Technology

1. 

   DELO DUALBOND® IC343 and DELO DUALBOND® AD345

   Flexible electronics offer enormous advantages over conventional electronics on classic PCBs in terms of design freedom and the associated weight and cost reductions. Particularly in the case of flexible hybrid electronics (FHE), whose high functionality is largely determined by the integration of rigid SMD components, adhesives can have many applications. Complex... Xem thêm

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2. 

   DELO adhesives for LED packaging

   LEDs are widely used due to their small form factor and high efficiency – as ambient lights or for sensors, for instance. They enable increasing miniaturization as well as design flexibility and versatile applications. Functional adhesives play a key role in the production of LED packages. They ensure brilliant, homogeneous diode... Xem thêm

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3. 

   DELO DUALBOND and DELO MONOPOX

   Bonding sensors in smartphones and similar devices. For lens bonding and active alignment processes, for example, DELO has developed special dual-curing products and mCD- &VLT-based adhesives. They can be fixed under light in less than a second, cured at very low temperatures ≥ 60 °C and offer properties such as low outgassing, high temperature... Xem thêm

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4. 

   DELO PHOTOBOND

   DELO PHOTOBOND adhesives are suitable for bonding a wide range of plastic components. Due to the fact that they cure within seconds, they allow particularly fast processes. The fluorescence of the adhesives enables reliable application control in automated processes. DELO DUALBOND adhesives combine the advantages of light curing with a second curing mechanism... Xem thêm

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