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THIẾT BỊ CÔNG NGHIỆP ĐIỆN TỬ

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  1. Ultron UH108 Series: (UH108, UH108-8, UH108-12

    FEATURES: – Adjustable spring-loaded roller assembly ensures bubble-free lamination – Adjustable cutting angle, depth, and diameter to control the amount of film overhang – Adjustable roller pressure from topside to accommodate different film requirements and various wafer thicknesses – Cuts film to edge of wafer, including flats, within 0.005″ – Vacuum-securing wafer stage – Wafer-centering mechanism – Retractable... Xem thêm
  2. Ultron UH114 & UH115 Series

    Ultron Systems’ Model UH114 & UH115 Series Mounters set the benchmark for both control and versatility. For dicing/sawing applications, uniform adhesive plastic film lamination is paramount. Our mounters feature an easily adjustable spring-loaded roller assembly, along with film-tensioner bars along both the x- and y-axes to ensure bubble-free lamination of... Xem thêm
  3. Ultron UH117 - UH118

    Ultron Systems’ Model UH117 Wafer Cleaning System provides an ideal solution for cleaning wafers after sawing or scribing. Operation is semiautomatic and fully programmable via the new touchscreen LCD panel. Microprocessor control ensures precise, flexible, uniform, and repeatable cleaning. Up to 10 programs can be stored for different processes. Each... Xem thêm
  4. Ultra System Model UH102 Series: (UH102-8, UH102-12)

    Ultron Systems’ Models UH102-8 and UH102-12 UV Curing Systems offer inexpensive solutions for the curing of UV films in easy-to-use benchtop packages, without sacrificing control or versatility The Model UH104 Series UV Curing Systems are the most cost-effective UV tape exposure solutions on the market. Despite their low cost, these units... Xem thêm
  5. Ultron - Model UH110 and UH110-8

    Ultron Systems’ Model UH110 and UH110-8 is wafer backgrinding protective - film remover - Semiautomatic Film Removers demount film from 3″ to 8″ wafers after the backgrinding or etching process. The virtual 180° peeling angle ensures more efficient peeling and lower stress on the wafer, resulting in higher yields. Both systems... Xem thêm
  6. Double layers PCB equipment

    1. Cutting: Cut the initial copper clad laminate into plates. 2. Drilling: Drill the hole diameter at the corresponding position on the sheet according to the material. 3. PTH: A thin layer of copper is deposited on the insulating hole wall by chemical method. 4. Exposure: Transfer the image on the production film... Xem thêm
  7. Baronete - Automatic Ultrasonic Vapor Degreaser Machine

    Technical Specifications Overall Dimensions : 27” Long x 24” Wide x 42” High Heat Input : 1,000 watts Power Supply : 120 VAC-1Ph-60Hz (20A GFCI) Refrigeration Unit : Air Cooled (¼ HP) R-513A Refrigeration Heat Load To Room : 3,000 BTU @ 200 CFM Thermal Capacity Per Hour : 25 Pounds Of Steel/20 Pounds Of Aluminum Distillation Rate : 1.8 GPH nPB (2.1 GPH... Xem thêm
  8. M Series Precision Vapor Degreaser

    We produce a vapor-only model (our MVR vapor degreasers), a liquid immersion model (our MLR vapor degreaser) and an ultrasonic vapor degreaser (our MSR model). These three different models are each available in five different sizes. Additionally, we develop and manufacture custom designs and sizes upon request. The M-Series vapor degreaser... Xem thêm
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