Sản phẩm nổi bật

1. 

   Solstice - Etching Mixture SWF(17266) Puranal

   These customized, application specific offerings provide improved cost of ownership (CoO), increased yield and ease-ofuse. Our application expertise maximizes customer wafer thinning processes with application development support and troubleshooting know-how while our consistent drum-to-drum and bottle-to-bottle wafer etching characteristics provide unsurpassed batch-to-batch product uniformity. A robust manufacturing infrastructure and application expertise further enable Honeywell to deliver flexible end products,... Xem thêm

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2. 

   Solstice PGMEA-Thinner ULSI Puranal

   Physical Properties Boiling Point/Range 145 °C (1,013 hPa) Color Colorless Density 0.97 g/cm3 (20 °C) Flashpoint 45 °C Melting Point/Range -66 °C (1,013 hPa) Odor Ether-Like Partition Coefficient 0.43 pH No data available Physical form Liquid Solubility Soluble in most organic solvents Solubility in Water 20 °C Vapor Pressure 3.6 hPa (20 °C) Xem thêm

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3. 

   Solstice - Ammonium Fluoride Etching Mixture

   Physical Properties Boiling Point/Range 100 °C Color Colorless Density 1.12 g/cm3 (20 °C) Flashpoint Does not flash Melting Point/Range No data available Odor Weak Partition Coefficient No data available pH Acidic Physical form Liquid, Clear Vapor Pressure similar to water Xem thêm

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4. 

   Buhler - Leybold Optics LTE

   Evaporation of different materials, including metals (metal lift-off) and oxides, different wafer sizes (from 1 to 6 inch, 8 and 12 inch on request) and capacity to manage high material volumes. Our solution is fully customizable and flexible. Experience cutting-edge evaporation technology with our uniquely designed system featuring a source-to-dome distance... Xem thêm

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5. 

   Silicone Gum PA 445200

   Silicone Gum PA 445200. PA445200canalsoimproveburningcharacteristicsof polyolefinswhenappliedincombinationwithhalogenfreeflameretardantfillers.PA445200isexpectedtogiveimproved benefitscomparedtoconventionallowermolecularweightadditives,e.g.lessscrewslippage,long-ermlowcoefficientof fiction,fewerpaintandprintingproblems,andabroaderrangeofperformancecapabilities ApplicationdetailsAdditivefor-polyolefincompounds-engineeringplasticscompounds TPEcompoundsPA445200isanadditive specificallydesignedforthecompoundingandmasterbatchindustry.Suitableequipmentforcompoundingcomprisestwin-screwextruder,co-kneader,andbatch-mixer.Becauseofitshighthermalstability,PA445200canbeappliedoverawide temperaturerange,upto300°C(570°F).CompoundingandsubsequentprocessingconditionsaredeterminedbythethermoplasticresinPA445200isaddedto.Forthecompoundingprocess,PA445200canbeaddedatthefeeding zone of theextrudereitheraspre-mixtogetherwiththeresinpolymerpelletsorviaseparatefeedingunitside-feeder.Itis recommendedtoavoidpressurewhenfeedingPA445200whichmayresultindeformationofthepellets. Xem thêm

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6. 

   GENIOPLAST®PP20A08

   GENIOPLAST®PP20A08shouldbeusedasacompoundingadditive.Typicalusagelevelisbetween0.5–2%.It’s recommendedtouseabout1%w/w).Thepelletsshouldbeusedinstandardextrusionequipmentsimilartostandard thermoplasticpellets.Suitableequipmentforcompoundingcomprisestwin-screwextruders,co-eaders,and batchmixers.Forthecompoundingprocess,GENIOPLAST®PP20A08canbeaddedatthefeedingzoneoftheextruder eitheraspremixtogetherwithresinpolymerpelletsorviaaseparatefeedingunit;itcanalsobeaddedviaside-feeder.RemovaloftheGENIOPLAST®PP20A08fromextrusionequipmentiseasilydonebypurgingwithstandard,nonadditivatedpolyolefinslikePP.Longtermprocessingtemperaturesabove230°CarenotrecommendedusingGENIOPLAST®PP20A08.GENIOPLAST®PP20A08iscompatiblewithallPPgrades,pigments,aswellasfillerssuchas woodfibers, talcorcalciumcarbonate Application: Thermoplastics & Elastomers Xem thêm

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7. 

   Solstice PGMEA-Thinner 17029

   General Information Application: Wafer fabrication CAS Number:  108-65-6 Grade: ULSI Synonyms:  Propylene glycol methyl ether acetate Physical Properties Boiling Point/Range:  145 °C (1,013 hPa) Color:   Colorless Density:  0.97 g/cm3 (20 °C) Flashpoint:  45 °C Melting Point/Range:  -66 °C (1,013 hPa) Odor:  Ether-Like Partition Coefficient:  0.43 pH:  No data available Physical form:  Liquid Solubility:  Soluble in most organic solvents Solubility in Water:   20 °C Vapor Pressure:  3.6 hPa (20 °C) Safety Information Chemical Stability:  Flammable... Xem thêm

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8. 

   Solstice TIMs for Telecom Data center - TGP8000PT/TGP6000PT/TGP3500PT/PTM6880

   The Gap pads effectively transfer heat in densely packed server architectures, ensuring that critical components remain stable and perform optimally under high thermal loads. Both these materials provide exceptional thermal contact, adapting to variable power loads typical of AI workloads, while maintaining long-term reliability. Overall, Phase Change Materials (PCMs) and... Xem thêm

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