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1. 

   Ultron UH108 Series: (UH108, UH108-8, UH108-12

   FEATURES: – Adjustable spring-loaded roller assembly ensures bubble-free lamination – Adjustable cutting angle, depth, and diameter to control the amount of film overhang – Adjustable roller pressure from topside to accommodate different film requirements and various wafer thicknesses – Cuts film to edge of wafer, including flats, within 0.005″ – Vacuum-securing wafer stage – Wafer-centering mechanism – Retractable... Xem thêm

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2. 

   Ultron UH114 & UH115 Series

   Ultron Systems’ Model UH114 & UH115 Series Mounters set the benchmark for both control and versatility. For dicing/sawing applications, uniform adhesive plastic film lamination is paramount. Our mounters feature an easily adjustable spring-loaded roller assembly, along with film-tensioner bars along both the x- and y-axes to ensure bubble-free lamination of... Xem thêm

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3. 

   Ultron UH117 - UH118

   Ultron Systems’ Model UH117 Wafer Cleaning System provides an ideal solution for cleaning wafers after sawing or scribing. Operation is semiautomatic and fully programmable via the new touchscreen LCD panel. Microprocessor control ensures precise, flexible, uniform, and repeatable cleaning. Up to 10 programs can be stored for different processes. Each... Xem thêm

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4. 

   Ultra System Model UH102 Series: (UH102-8, UH102-12)

   Ultron Systems’ Models UH102-8 and UH102-12 UV Curing Systems offer inexpensive solutions for the curing of UV films in easy-to-use benchtop packages, without sacrificing control or versatility The Model UH104 Series UV Curing Systems are the most cost-effective UV tape exposure solutions on the market. Despite their low cost, these units... Xem thêm

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5. 

   Ultron - Model UH110 and UH110-8

   Ultron Systems’ Model UH110 and UH110-8 is wafer backgrinding protective - film remover - Semiautomatic Film Removers demount film from 3″ to 8″ wafers after the backgrinding or etching process. The virtual 180° peeling angle ensures more efficient peeling and lower stress on the wafer, resulting in higher yields. Both systems... Xem thêm

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6. 

   Condura®.prime and Condura®.ultra – Standard and Ag-free Silicon Nitride (Si3N4)

   Condura®.prime and Condura®.ultra – Standard and Ag-free Silicon Nitride (Si3N4) Active Metal Brazed (AMB) Substrates High thermal conductivity and mechanical robustness for demanding applications  Our Si3N4 AMB (Active Metal Brazed) substrates, including Condura®.prime and Condura®.ultra, offer high heat dissipation and increased module lifetime. These substrates stand out due to their low thermal resistance and high mechanical robustness. Specifically designed for... Xem thêm

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7. 

   Heraeus Electronics SMT Adhesives PD955M

   Heraeus Electronics SMT Adhesives series: PD955M  PD955PRM  PD955PY  PD205A-Jet The Surface-Mount Technology (SMT) adhesives portfolio at Heraeus Electronics offers outstanding properties during the process as well as after soldering, ideal for high-speed processes.  During the fast placement process in Surface-Mount Technology, our adhesives with high-green strength are critical to prevent the displacement of... Xem thêm

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8. 

   Fuel Cells Pastes - Heraeus

   Heraeus Thick Film Materials  for Solid Oxide Fuel Cells Pastes Materials applicable on different substrates like ceramic and steel and with different application methods are available. Based on this, Heraeus has applied its expertise to Solid. Oxide Fuel Cells (SOFC). The product range includes pastes for anodes, electrolytes, athodes, current collectors,... Xem thêm

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