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Low Dielectric Material - SLK Series
In particular, SLK has exellent characteristics in the high frequency band such as milimetter waves. It can be used for next generation interlayer insulating films, copper clad laminates (CCL) and flexible subtrates (FCCL). SLK has possible to design high-adhesion and low-warp coating materials by using it Thermal dicomposition temperature: TGA >... Xem thêm -
KJR 9080/9085/9089/T006 KJC5080H2 - silicone material & resin
Shin-Etsu liquid crystal electrode protective silicone resin is manufactured under our strict quality control procedures, and can shorten the curing time of large-sized liquid crystal panels. Shin-Etsu has various materials from UV curing to room temperature curable type. Shin-Etsu has highly adhesive and heat resistant type silicone material that take advantage... Xem thêm -
G- and I-Line Resist
I-Line Resist Lineup G-Line Resist We offer a wide range of resists, including thick film types, high-sensitivity types, dye-infused types for high-reflection substrates such as polysilicon and tungsten wiring, etc. The following is a list of our representative products. Please feel free to contact us for regarding these or additional types of... Xem thêm -
EUV Resist
Tokyo Ohka Kogyo has been engaged in research and development, manufacturing, and sales of resists starting with rubber-based negative resists until present day. We are also continuing to research and develop EUV resists with absorption wavelength of 13.5nm, the most advanced technology today, and are already approved for use in... Xem thêm -
Reflective Multilayer Materials
This helps to suppress standing waves caused by interference within the resist layer during exposure, which can lead to variations in sidewall profiles and critical dimensions. As a result, BARC improves the accuracy of lithography. We supply BARC materials that do not contain PFOS and PFOA, which are internationally regulated as persistent organic... Xem thêm -
ShellSol T - synthetical isoparaffinic hydrocarbon
Typical Physical Properties Property Unit Value MethodDensity @ 15°C kg/l 0.761 ASTM D4052Coefficient of Cubic Expansion @ 20°C 10 -4 10 calculatedRefractive Index @ 20°C - 1.425 ASTM D1218Colour Saybolt +30 ASTM D156Bromine index mg Br/100g 350 ASTM D2710Copper Corrosion (1hr @ 100°C) - 1 ASTM D130Doctor Test - Negative... Xem thêm -
Honeywell - Texture Etch for Wafer Thinning Materials
Applications• Increases surface area with uniform dimples to promote improved back-metal tensile strength• Typical dimple depth is 0.00003 inch (8,000Å/0.8µm) These customized, application specific offerings provide improved cost of ownership (CoO), increased yield and ease-ofuse. Our application expertise maximizes customer wafer thinning processes with application development support and troubleshooting know-how while our consistent drum-to-drum and bottle-to-bottle wafer etching characteristics provide... Xem thêm -
Solstice - Etching Mixture SWF(17266) Puranal
These customized, application specific offerings provide improved cost of ownership (CoO), increased yield and ease-ofuse. Our application expertise maximizes customer wafer thinning processes with application development support and troubleshooting know-how while our consistent drum-to-drum and bottle-to-bottle wafer etching characteristics provide unsurpassed batch-to-batch product uniformity. A robust manufacturing infrastructure and application expertise further enable Honeywell to deliver flexible end products,... Xem thêm
