HOÁ CHẤT CÔNG NGHIỆP ĐIỆN TỬ

1. 

   Honeywell - Texture Etch for Wafer Thinning Materials

   Applications• Increases surface area with uniform dimples to promote improved back-metal tensile strength• Typical dimple depth is 0.00003 inch (8,000Å/0.8µm) These customized, application specific offerings provide improved cost of ownership (CoO), increased yield and ease-ofuse. Our application expertise maximizes customer wafer thinning processes with application development support and troubleshooting know-how while our consistent drum-to-drum and bottle-to-bottle wafer etching characteristics provide... Xem thêm

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2. 

   Solstice - Etching Mixture SWF(17266) Puranal

   These customized, application specific offerings provide improved cost of ownership (CoO), increased yield and ease-ofuse. Our application expertise maximizes customer wafer thinning processes with application development support and troubleshooting know-how while our consistent drum-to-drum and bottle-to-bottle wafer etching characteristics provide unsurpassed batch-to-batch product uniformity. A robust manufacturing infrastructure and application expertise further enable Honeywell to deliver flexible end products,... Xem thêm

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3. 

   Solstice PGMEA-Thinner ULSI Puranal

   Physical Properties Boiling Point/Range 145 °C (1,013 hPa) Color Colorless Density 0.97 g/cm3 (20 °C) Flashpoint 45 °C Melting Point/Range -66 °C (1,013 hPa) Odor Ether-Like Partition Coefficient 0.43 pH No data available Physical form Liquid Solubility Soluble in most organic solvents Solubility in Water 20 °C Vapor Pressure 3.6 hPa (20 °C) Xem thêm

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4. 

   Solstice - Ammonium Fluoride Etching Mixture

   Physical Properties Boiling Point/Range 100 °C Color Colorless Density 1.12 g/cm3 (20 °C) Flashpoint Does not flash Melting Point/Range No data available Odor Weak Partition Coefficient No data available pH Acidic Physical form Liquid, Clear Vapor Pressure similar to water Xem thêm

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5. 

   Solstice PGMEA-Thinner 17029

   General Information Application: Wafer fabrication CAS Number:  108-65-6 Grade: ULSI Synonyms:  Propylene glycol methyl ether acetate Physical Properties Boiling Point/Range:  145 °C (1,013 hPa) Color:   Colorless Density:  0.97 g/cm3 (20 °C) Flashpoint:  45 °C Melting Point/Range:  -66 °C (1,013 hPa) Odor:  Ether-Like Partition Coefficient:  0.43 pH:  No data available Physical form:  Liquid Solubility:  Soluble in most organic solvents Solubility in Water:   20 °C Vapor Pressure:  3.6 hPa (20 °C) Safety Information Chemical Stability:  Flammable... Xem thêm

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6. 

   Solstice TIMs for Telecom Data center - TGP8000PT/TGP6000PT/TGP3500PT/PTM6880

   The Gap pads effectively transfer heat in densely packed server architectures, ensuring that critical components remain stable and perform optimally under high thermal loads. Both these materials provide exceptional thermal contact, adapting to variable power loads typical of AI workloads, while maintaining long-term reliability. Overall, Phase Change Materials (PCMs) and... Xem thêm

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7. 

   Solstice TIMs for Consumer Electronics - PTM7950SP/PTM7900/TGP6000PT/TGP3500PT

   Consumer Electronics Segment Notebook/ Tablet/PC Gaming Console Projector Camera/GPS Applications GPU/CPU GPU/CPU Laser CPU/Memory Products PCMs- PTM7950- PTM7950SP- PTM7900- PTM7900SPTwo-part Thermally Conductive Gel- HLT3500 PCM- PTM5000 PCMs- PTM7900- PTM7950SP Thermal Gap Pads- TGP6000PT- TGP3500PTTwo-part Thermally Conductive Gel- HLT3500 Xem thêm

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8. 

   Solstice TIMs for EV - PTM7900/PTM7000/HLT10000/HLT8000

   The following thermal management solutions are designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing required for long product life applications. Solstice thermal solutions offer stable thermal impedance across accelerated aging tests and do not display bleeding, pumping, or flow out. Auto Electronics/Electric Vehicles (EV) Segment Inverter DC/DC... Xem thêm

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