HOÁ CHẤT CÔNG NGHIỆP ĐIỆN TỬ

1. 

   Performance Chemicals for Semiconductor Packaging

   ECORELTM and ECOFRECTM soldering materials are utilized in processes such as ball attach (CSP, BGA), flip chip, and wafer bumping, which are used in the manufacturing of power semiconductors, flash memories, micro-modules and hybrid assemblies ECORELTM solder pastes exhibit good wettability on Ni, NiP, Cu and Pb finished surfaces with a low percentage of voids... Xem thêm

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2. 

   SamSol - HFE 71 and HFE 72

   Banner Chemicals Group: SamSol - HFE 71 Replacement for 3M Novec 7100 Engineered Fluid SamSol - HFE 72 Replacement for 3M Novec 7200 Engineered Fluid Xem thêm

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3. 

   ECOREL solder pastes

   ECORELsolder pastes meet the challenging requirements of the electronics industry due to the evolution of the technology itself, meeting and exceeding the strictest legislative requirements for products that are Halogen-free, lead-free, serving applications such as embedded technologies, hybrid assembly, and miniaturization. Our solder pastes are available in alternative alloys, including... Xem thêm

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4. 

   Environ Tech ETI 7100

   ETI 7100 is a high-performance engineered fluid designed as a direct replacement for Novec 7100, offering the same exceptional cleaning, heat transfer, and solvent properties. Composed primarily of the major isomer found in Novec 7100, ETI 7100 delivers consistent performance across a wide range of industrial applications, including precision cleaning,... Xem thêm

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5. 

   Aluminium based copper clad laminate plate

   This series of products is the company to meet the requirements of the market, the success of the promotion and is worthy of reliance on a special plate.Has the good heat dissipation performance, the outstanding heat resistance, the good insulation reliability, the good machinability and so on characteristic.      a.... Xem thêm

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6. 

   Condura®.prime and Condura®.ultra – Standard and Ag-free Silicon Nitride (Si3N4)

   Condura®.prime and Condura®.ultra – Standard and Ag-free Silicon Nitride (Si3N4) Active Metal Brazed (AMB) Substrates High thermal conductivity and mechanical robustness for demanding applications  Our Si3N4 AMB (Active Metal Brazed) substrates, including Condura®.prime and Condura®.ultra, offer high heat dissipation and increased module lifetime. These substrates stand out due to their low thermal resistance and high mechanical robustness. Specifically designed for... Xem thêm

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7. 

   Heraeus Electronics SMT Adhesives PD955M

   Heraeus Electronics SMT Adhesives series: PD955M  PD955PRM  PD955PY  PD205A-Jet The Surface-Mount Technology (SMT) adhesives portfolio at Heraeus Electronics offers outstanding properties during the process as well as after soldering, ideal for high-speed processes.  During the fast placement process in Surface-Mount Technology, our adhesives with high-green strength are critical to prevent the displacement of... Xem thêm

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8. 

   Fuel Cells Pastes - Heraeus

   Heraeus Thick Film Materials  for Solid Oxide Fuel Cells Pastes Materials applicable on different substrates like ceramic and steel and with different application methods are available. Based on this, Heraeus has applied its expertise to Solid. Oxide Fuel Cells (SOFC). The product range includes pastes for anodes, electrolytes, athodes, current collectors,... Xem thêm

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