Tất cả sản phẩm

1. 

   Ultron UH117 - UH118

   Ultron Systems’ Model UH117 Wafer Cleaning System provides an ideal solution for cleaning wafers after sawing or scribing. Operation is semiautomatic and fully programmable via the new touchscreen LCD panel. Microprocessor control ensures precise, flexible, uniform, and repeatable cleaning. Up to 10 programs can be stored for different processes. Each... Xem thêm

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2. 

   Ultra System Model UH102 Series: (UH102-8, UH102-12)

   Ultron Systems’ Models UH102-8 and UH102-12 UV Curing Systems offer inexpensive solutions for the curing of UV films in easy-to-use benchtop packages, without sacrificing control or versatility The Model UH104 Series UV Curing Systems are the most cost-effective UV tape exposure solutions on the market. Despite their low cost, these units... Xem thêm

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3. 

   Ultron - Model UH110 and UH110-8

   Ultron Systems’ Model UH110 and UH110-8 is wafer backgrinding protective - film remover - Semiautomatic Film Removers demount film from 3″ to 8″ wafers after the backgrinding or etching process. The virtual 180° peeling angle ensures more efficient peeling and lower stress on the wafer, resulting in higher yields. Both systems... Xem thêm

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4. 

   Condura®.prime and Condura®.ultra – Standard and Ag-free Silicon Nitride (Si3N4)

   Condura®.prime and Condura®.ultra – Standard and Ag-free Silicon Nitride (Si3N4) Active Metal Brazed (AMB) Substrates High thermal conductivity and mechanical robustness for demanding applications  Our Si3N4 AMB (Active Metal Brazed) substrates, including Condura®.prime and Condura®.ultra, offer high heat dissipation and increased module lifetime. These substrates stand out due to their low thermal resistance and high mechanical robustness. Specifically designed for... Xem thêm

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5. 

   Heraeus Electronics SMT Adhesives PD955M

   Heraeus Electronics SMT Adhesives series: PD955M  PD955PRM  PD955PY  PD205A-Jet The Surface-Mount Technology (SMT) adhesives portfolio at Heraeus Electronics offers outstanding properties during the process as well as after soldering, ideal for high-speed processes.  During the fast placement process in Surface-Mount Technology, our adhesives with high-green strength are critical to prevent the displacement of... Xem thêm

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6. 

   Fuel Cells Pastes - Heraeus

   Heraeus Thick Film Materials  for Solid Oxide Fuel Cells Pastes Materials applicable on different substrates like ceramic and steel and with different application methods are available. Based on this, Heraeus has applied its expertise to Solid. Oxide Fuel Cells (SOFC). The product range includes pastes for anodes, electrolytes, athodes, current collectors,... Xem thêm

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7. 

   High Quality PCB Component Mark Ink Silksc

   Ksm-150 series UV-curable marking ink, with good screen crossing, clear character, fast curing speed, excellent adhesion, chemical resistance and insulation, suitable for single panel substrate and single, double side solder film character marking.   Model: KSM-388 Item: Technical indicators: Remark: Color: White, Black   Fineness: ≤8μm 0-25μm Scraper fineness meter Post-mixing viscosity25℃): 280±20dPa.s VT-04F Post-mixing density(25℃) 1.2-1.4g/ml   Screen: 90-120T   Film thickness: 12-16μm   Curing engery 1500-2000mJ/cm2 UV energy to reach the ink Pencil hardness： ≥4H Pencil hardness tester Adhesion: 100/100 The... Xem thêm

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8. 

   Double layers PCB equipment

   1. Cutting: Cut the initial copper clad laminate into plates. 2. Drilling: Drill the hole diameter at the corresponding position on the sheet according to the material. 3. PTH: A thin layer of copper is deposited on the insulating hole wall by chemical method. 4. Exposure: Transfer the image on the production film... Xem thêm

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