Tất cả sản phẩm

1. 

   Silicone Gum PA 445200

   Silicone Gum PA 445200. PA445200canalsoimproveburningcharacteristicsof polyolefinswhenappliedincombinationwithhalogenfreeflameretardantfillers.PA445200isexpectedtogiveimproved benefitscomparedtoconventionallowermolecularweightadditives,e.g.lessscrewslippage,long-ermlowcoefficientof fiction,fewerpaintandprintingproblems,andabroaderrangeofperformancecapabilities ApplicationdetailsAdditivefor-polyolefincompounds-engineeringplasticscompounds TPEcompoundsPA445200isanadditive specificallydesignedforthecompoundingandmasterbatchindustry.Suitableequipmentforcompoundingcomprisestwin-screwextruder,co-kneader,andbatch-mixer.Becauseofitshighthermalstability,PA445200canbeappliedoverawide temperaturerange,upto300°C(570°F).CompoundingandsubsequentprocessingconditionsaredeterminedbythethermoplasticresinPA445200isaddedto.Forthecompoundingprocess,PA445200canbeaddedatthefeeding zone of theextrudereitheraspre-mixtogetherwiththeresinpolymerpelletsorviaseparatefeedingunitside-feeder.Itis recommendedtoavoidpressurewhenfeedingPA445200whichmayresultindeformationofthepellets. Xem thêm

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2. 

   GENIOPLAST®PP20A08

   GENIOPLAST®PP20A08shouldbeusedasacompoundingadditive.Typicalusagelevelisbetween0.5–2%.It’s recommendedtouseabout1%w/w).Thepelletsshouldbeusedinstandardextrusionequipmentsimilartostandard thermoplasticpellets.Suitableequipmentforcompoundingcomprisestwin-screwextruders,co-eaders,and batchmixers.Forthecompoundingprocess,GENIOPLAST®PP20A08canbeaddedatthefeedingzoneoftheextruder eitheraspremixtogetherwithresinpolymerpelletsorviaaseparatefeedingunit;itcanalsobeaddedviaside-feeder.RemovaloftheGENIOPLAST®PP20A08fromextrusionequipmentiseasilydonebypurgingwithstandard,nonadditivatedpolyolefinslikePP.Longtermprocessingtemperaturesabove230°CarenotrecommendedusingGENIOPLAST®PP20A08.GENIOPLAST®PP20A08iscompatiblewithallPPgrades,pigments,aswellasfillerssuchas woodfibers, talcorcalciumcarbonate Application: Thermoplastics & Elastomers Xem thêm

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3. 

   Solstice PGMEA-Thinner 17029

   General Information Application: Wafer fabrication CAS Number:  108-65-6 Grade: ULSI Synonyms:  Propylene glycol methyl ether acetate Physical Properties Boiling Point/Range:  145 °C (1,013 hPa) Color:   Colorless Density:  0.97 g/cm3 (20 °C) Flashpoint:  45 °C Melting Point/Range:  -66 °C (1,013 hPa) Odor:  Ether-Like Partition Coefficient:  0.43 pH:  No data available Physical form:  Liquid Solubility:  Soluble in most organic solvents Solubility in Water:   20 °C Vapor Pressure:  3.6 hPa (20 °C) Safety Information Chemical Stability:  Flammable... Xem thêm

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4. 

   Solstice TIMs for Telecom Data center - TGP8000PT/TGP6000PT/TGP3500PT/PTM6880

   The Gap pads effectively transfer heat in densely packed server architectures, ensuring that critical components remain stable and perform optimally under high thermal loads. Both these materials provide exceptional thermal contact, adapting to variable power loads typical of AI workloads, while maintaining long-term reliability. Overall, Phase Change Materials (PCMs) and... Xem thêm

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5. 

   Solstice TIMs for Consumer Electronics - PTM7950SP/PTM7900/TGP6000PT/TGP3500PT

   Consumer Electronics Segment Notebook/ Tablet/PC Gaming Console Projector Camera/GPS Applications GPU/CPU GPU/CPU Laser CPU/Memory Products PCMs- PTM7950- PTM7950SP- PTM7900- PTM7900SPTwo-part Thermally Conductive Gel- HLT3500 PCM- PTM5000 PCMs- PTM7900- PTM7950SP Thermal Gap Pads- TGP6000PT- TGP3500PTTwo-part Thermally Conductive Gel- HLT3500 Xem thêm

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6. 

   Solstice TIMs for EV - PTM7900/PTM7000/HLT10000/HLT8000

   The following thermal management solutions are designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing required for long product life applications. Solstice thermal solutions offer stable thermal impedance across accelerated aging tests and do not display bleeding, pumping, or flow out. Auto Electronics/Electric Vehicles (EV) Segment Inverter DC/DC... Xem thêm

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7. 

   Solstice Thermal Two-Part Hybrids HLT10000/HGP14

   Two component hybrid thermal gels can be cured in a short time after two-component mixing at room temperature. HLT series thermal gels require curing but very little pressure during installation (5-10psi or the weight of a heatsink is sufficient). You can speed up the process by curing at elevated temperatures... Xem thêm

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8. 

   Solstice Thermal Interface Material (TIM) PTM7950 / PTM6880

   As a category leader in the Phase Change Material (PCM) space, Solstice is proud to introduce PTM6880, an advanced Phase Change Material (PCM) that provides superior reliability (pass 150˚C baking 1000 hours, thermal shock 1000 cycles, and maintains low thermal impedance (<0.06˚C.cm2/W@ no shim), making it an ideal choice for... Xem thêm

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