Tất cả sản phẩm

1. 

   Zepto One - Zepto - Atto - Femto - Plasma cleaner system

   Femto: Chamber volume: approx. 2 - 3 litres Housing:   Tabel top / Stand alone W: 310 - 560 / 600 mm H: 211 - 860 / 1700 mm D: 420 - 600 / 800 mm Generator: • 40 kHz / 0 - 100 W                   • 100 kHz / 0... Xem thêm

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2. 

   UCT

   To maintain a clean process environment, PVD chambers require adhesion of excess sputtered material to exposed part surfaces. Greater adherence means thicker films can accumulate on the part surface, thereby reducing the frequency of PM. Since residual stress depends on the material (e.g., Ti, TiN, W), optimization of the coating... Xem thêm

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3. 

   UCT - ChemTrace Labs (AACL)

   Our Advance Accredited ChemTrace Labs (AACL) provide wafer surface analysis techniques with high sensitivity for trace metals, organics and particles ─ contaminants that can directly impact device performance. Whether the area of concern is the full wafer surface, a target surface region or a profile into the film, our suite... Xem thêm

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4. 

   ALPHA® Argomax® 2040 - 2041 Paste

   Argomax 2141® Paste is an integrated solution and an extension to the highly successful Argomax range. This product is a dispensable paste offering flexibility and ease of use. The paste has specifically been developed for large packages (or components) on gold- and silver-finished substrates (like DBC, Aluminum and Copper coolers).... Xem thêm

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5. 

   ALPHA® Argomax® 2020 Paste

   A silver sinter paste, providing high thermal and electrical conductivity. The paste provides superior thermal conductivity and low electrical resistivity, ensuring efficient heat and current transfer within devices The paste provides superior thermal conductivity and low electrical resistivity, ensuring efficient heat and current transfer within devices. Creates strong silver sinter bonds that enhance... Xem thêm

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6. 

   ALPHA® HiTech® UP44-5566T

   A versatile, high-performance underfill adhesive specifically developed for electronics assembly applications. This single-component adhesive provides excellent reliability and protection for delicate components, particularly in Surface-Mount Technology (SMT) and flip-chip assemblies. ALPHA® HiTech UP44-5566T offers a fast curing process, ensuring high throughput in production. This adhesive cures quickly under ultraviolet light, enabling... Xem thêm

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7. 

   ALPHA® HiTech® AD13-9692B

   A one-component, low-temperature curing epoxy adhesive designed specifically for bonding heat-sensitive devices. Ideal for applications in camera modules and other optical devices where low thermal exposure is critical, the AD13-9692B offers strong adhesion at temperatures low enough to prevent damage to sensitive components, while maintaining flexibility in automated manufacturing. Allows for... Xem thêm

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8. 

   ALPHA® HiTech® AD13-9521B

   A high-performance, one-component epoxy adhesive designed for bonding applications in electronics manufacturing. It provides excellent adhesion to a variety of substrates, including metals, ceramics, and plastics, making it versatile for diverse assembly needs. It cures quickly at low temperatures, making it ideal for heat-sensitive components, ensuring reliability while minimizing thermal... Xem thêm

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